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PCB Level EMI/RFI Shielding

Custom EMI & RFI Shielding

We have years of industry experience in PCB-level shielding, focusing on producing custom PCB-level EMI/RFI shielding cans for various electronic applications using photochemical etching technology.

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Introduction Advantages Metal Grades Applications Customization Samples

Understanding PCB-Level EMI/RFI Shielding

EMI shielding, also known as electromagnetic shielding, is crucial for protecting electronic components from interference. It involves using special materials and techniques to block outside electromagnetic signals and prevent internal interference.

In PCBs, shielding is often done using PCB Grade EMI/RFI Shielding Cans. These are metal enclosures, usually made of aluminum or nickel-iron alloy, designed to shield circuit boards from electromagnetic and radio frequency interference.

These shielding cans keep electronic devices safe from interference, ensuring they work properly, especially in high-frequency circuits. By blocking electromagnetic radiation from the environment or other devices, they help maintain the stability and performance of the circuit board.

PCB Grade EMI/RFI Shielding Cans are installed on circuit boards using specific connectors or soldering techniques to ensure they work effectively. Dealing with electromagnetic compatibility (EMC) issues and using proper shielding measures are vital for designing reliable electronic devices, making these shielding cans essential components in electronics engineering.

pcb emi shield custom-emi-shielding Customized-Board-Level-Shielding-PCB-Sheet emi-shield-can

Chemically etched PCB shielding can

TMN can chemically etch any shielding solution you need.

Benefits of the Etching Process

Rapid Prototyping with Low Development Costs

During the early stages of development, production involves simple etching and bending processes, resulting in fast turnaround times and low development costs.
The flexibility of design modifications is high, eliminating the need for expensive tooling expenses.

Customized Markings for Enhanced Traceability

All shielding surfaces can be etched with various markings including logos, material numbers, batch numbers, and alphanumeric codes for improved traceability.

Unlimited Design Possibilities

EMI/RFI shielding components can undergo semi-etching at different positions and depths, catering to the demands of complex, high-quality designs without limitations.

Versatility in Functionality

Digital tools are cost-effective and allow for swift and economical modifications, ensuring efficient production processes.

Electroplating for Enhanced Properties

Parts can be electroplated to enhance solderability, functionality, aesthetics, and protection, adding value to the final product.

Burr-Free and Stress-Free Components

All parts are free from burrs and stress, significantly reducing assembly time on production lines.

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Metal Grades for EMI and RFI Shielding

Material Characteristics Applications
Copper – EMI/RFI Shielding Frame/Blank: Cu-C7521-H, Cu-C7521-OH, Copper-Nickel-Zinc Alloy, Nickel Silver – Frame/blank for shielding – Shielding cover for bending process
– EMI/RFI Shielding Cover: SUS304R-1/2H (for bending process), SUS304R-1/4H, Tin-plated Steel
Tin-plated Steel – EMI/RFI Shielding Used for PCB Assembly: Provides effective shielding with corrosion resistance – PCB assembly
Nickel Silver – EMI/RFI Shielding Used for PCB Assembly: Offers excellent electrical conductivity and corrosion resistance – PCB assembly
Nickel Plated Steel – EMI/RFI Shielding Used for PCB Assembly: Provides strong shielding with enhanced durability – PCB assembly
Copper-Nickel-Zinc Alloy – EMI/RFI Shielding Frame/Blank: Offers a combination of conductivity and corrosion resistance – Frame/blank for shielding
SUS304R Stainless Steel – EMI/RFI Shielding Cover: Provides durability and corrosion resistance, suitable for bending processes – Shielding cover for bending process

EMI & RFI Shielding Applications

Aerospace

Aerospace

Automotive

Automotive

Electronics

Electronics

Industrial Automation

Industrial Automation

Optical

Optical

Circuitry

Circuitry

Description of Custom EMI/RFI Shielding

1、Drawings are needed at the format of DWG/DXF/3D file.
2、Production Volume,1800 square meter/day
3、Inspection equipment,Two-dimension inspection machine
4、Packing method ,tape and reel ,blister package .
5、Sample lead time ,3-5 days
6、Industry Standards,ISO 9001: 2015

EMI & RFI Shielding Samples

We provide a range of EMI/RFI shielding solutions including shielding blanks, tin-plated shielding covers, PCB shielding cans, customized solutions, and more.

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